EC010606L03 High Speed Digital Design B.Tech Model Question Paper : mgu.ac.in

Name of the University : Mahatma Gandhi University
Department : Electronics and Communication Engineering
Degree : B.Tech
Subject Code/Name : EC010 606 L03/High Speed Digital Design
Sem : VI
Website : mgu.ac.in
Document Type : Model Question Paper

Download Model/Sample Question Paper : https://www.pdfquestion.in/uploads/mgu.ac.in/5141-EC%20606-3.pdf

High Speed Digital Design Question Paper :

B.TECH Degree Examination- 2012 :
Model Question :
Sixth Semester :

Related : MGU MECVE106-4 Modeling of Embedded Systems M.Tech Model Question Paper : www.pdfquestion.in/5065.html

Branch: Electronics and Communication Engineering
EC010 606 L03- High Speed Digital Design
(Regular)
Time: Three Hours
Maximum: 100 Marks
PART A :
Answer all questions briefly. :
Each question carries 3 marks. :
1. Differentiate between lumped and distributed systems with an example.
2. Comment on the self inductance of probe ground loops.
3. Write a note on RC transmission lines.

4. What are the relevant electrical properties of vias.
5. What is the need for a stable voltage reference in the power system of high frequency digital circuits?
(5×3=15 marks)

PART B :
Answer all questions. :
Each question carries 5 marks. :
6. Explain how the following are related with reference to high speed digital circuits:
(a) Frequency and Time.
(b) Time and Distance.
7. How do rise time and bandwidth affect the performance of oscilloscope probes?

8. What are the different forms of transmission lines? What are the different characteristics of an ideal transmission line at high speeds?
9. Briefly describe the different characteristics of source and middle terminators.

10. What are the factors that need to be considered while choosing a bypass capacitor for the power wiring in high speed digital design?
(5×5=25 marks)

PART C :
Answer any one question from each module. :
Each question carries 12 marks. :
11. Explain the four different circuit concepts that differentiate between high frequency and low frequency digital circuits. Highlight their step response and mention how they are related to cross talk.
OR
12. Elaborate on the different kinds of powers that arise when logic gates work at high speeds.

13. Explain in detail the special types of probing fixtures that can overcome the problems of ground loop inductance and shunt capacitance.
OR
14. Discuss the problems of point-to-point wiring at high frequencies. Which is a better medium of communication at such high frequencies?

15. Explain the importance of lossy and low-loss transmission lines in the study of high speed circuits. Support your explanation with necessary equations.
OR
16. Explain the different factors that affect the attenuation in transmission lines.

17. Give details of the different characteristics of end terminators to be considered when designing high frequency circuits.
OR
18. Explain the important electrical properties of connectors in high speed circuits.

19. Elaborate on the delay adjustments that are made in the clock distribution of high speed ICs.
OR
20. Write notes on the timing margins of of high speed circuits. What are clock skew and clock jitter? How do they differ from each other? Explain.

Syllabus :
EC010 606L03 High Speed Digital Design
Module I : (12hours)
High Speed Digital Design Fundamentals : Frequency and time, Time and distance, Lumped vs distributed, four kinds of reactance- ordinary capacitance and inductance, mutual capacitance and inductance, Relation of mutual capacitance and mutual inductance to cross talk.

High Speed properties of Logic gates : Power, Quicent vs active dissipation, Active power driving a capacitive load, Input power, Internal dissipation, drive circuit dissipation, Totem pole and open circuit, speed, Sudden change in voltage and current.

Module II : (12 hours)
Measurement Techniques; Rise time and bandwidth of oscilloscope probes, self inductance of probe ground loop, Effects of probe load on a circuit, special probing fixtures. Transmission Lines; Problems of point to point wiring, signal distortion, EMI, cross talk.

Module III : (12 hours)
Transmission Lines at High frequency : Infinite uniform transmission line, Lossy transmission line, Low loss transmission line, RC transmission line, Skin effect, Proximity effect, and Dielectric loss.

Module IV : (12 hours)
Termination : End termination, rise time, dc biasing, power dissipation, Source termination, Resistance value, Rise time, Power dissipation, Drive current, Middle terminators,
Vias : mechanical properties, capacitance and inductance Connectors: mutual, series and parasitic capacitance.

Module V : (12 hours)
Power system : Stable voltage reference, Uniform voltage distribution, choosing a bypass capacitor,
Clock Distribution : Timing margin, Clock skew, delay adjustments, Clock jitter.