EI010804 L04 Real Time Embedded Systems B.Tech Model Question Paper : mgu.ac.in

Name of the College : Mahatma gandhi University
Department : ELECTRONICS AND INSTRUMENTATION ENGINEERING
Subject Code/Name : EI 010 804 L04/REAL TIME EMBEDDED SYSTEMS
Sem : VIII
Website : mgu.ac.in
Document Type : Model Question Paper

Download Model/Sample Question Paper : https://www.pdfquestion.in/uploads/mgu.ac.in/4981-EI010804L04-%20Real%20Time%20Embedded%20Systems.pdf

Real Time Embedded Systems Questions :

M. G. UNIVERSITY BTECH DEGREE EXAMINATION MODEL QUESTION PAPER :
ELECTRONICS AND INSTRUMENTATION ENGINEERING
VIIIth SEMESTER

Related : MGU0 AI010804L01 Neural Networks B.Tech Model Question Paper : www.pdfquestion.in/4971.html

MAX MARKS:100
DURATION: 3 hrs
PART –A : (answer all questions) (3marks each)
1. Differentiate between hard real time and soft real time embedded systems with examples of each
2. How does a macro differ from a function?
3. List a couple of kernel services/functions in an operating system
4. Briefly describe the term ‘mutex’.
5. What are the types of RTOSes available?

PART –B : (Answer all questions) (5 marks each)
6. Explain any 5 uses of timer in a system.
7. Enumerate with examples the uses of null pointer.
8. Name the five states of a task and describe each one.
9. How can inter process communication be achieved using pipes?
10. List the basic functions available in a commercial RTOS.

PART-C : (Answer any one ) (12 marks each)
11. Explain any two serial communication protocols with necessary diagrams
Or
12. Write short notes on
(a) Watch dog timer
(b) HDLC

13. (a)List the advantages and disadvantages of embedded programming in C++.
(b) Describe the various pre-processor structural elements in a program.
Or
14. What are the uses of function call? With the help of a pseudo code explain how multiple function calls are done in cyclic order.

15. (a)Differentiate between function, ISR and task
(b) Explain in detail the functions of a device manager
Or
16. (a) Explain the various strategies adopted for managing memory in a system
(b) Explain the layered architecture of system that employs an OS.

17. (a)Using a hypothetical example, explain dead lock situation in the concept of semaphores.
(b). Describe an IPC method which uses the shortest time for communication.
Or
18. Explain queues and message boxes used for inter process communication. What are the various RTOS functions available to use them in an application.

19. Write short notes on
(a) Semaphore related functions in any popular RTOS
(b) Time delay functions
Or
20. With necessary examples and pseudo codes describe how system level functions are invoked in an RTOS.

B.Tech Degree Examination :
Eighth Semester Model Question Paper
Branch : Electronics and Instrumentation Engineering
EI 010 804 L02 Micro Electro Mechanical Systems
Time : Three hours
Maximum Marks : 100
Part A :
Answer all questions
Each question carries 3 marks
1. Explain the difference between MEMS and microsystems
2. What are the three principal signal transduction methods for micropressure sensors.
3. Describe the role of quantum physics in the design of MEMS and Microsystems.

4. Briefly explain plasma etching process.
5. What are the mechanical problems associated with surface micromachining? (3 x 5 = 15 marks)

Part B :
Answer all questions
Each question carries 5 marks
6. Explain with a block diagram the components of a microsystem.
7. Describe microactuation with shape memory alloys.
8. Write a short note about conductive polymers used in MEMS.

9. Compare APCVD, LPCVD and PECVD and give an application for each.
10. Differentiate dry etching and wet etching in bulk micromachining. (5 x 5 = 25 marks)

Part B :
Answer any one question from each module
Each question carries 12 marks
MODULE I :
11. Explain in detail at least three applications of MEMS in industry. or
12. Write short notes on microgears, micromotors and microturbines.

MODULE II :
13. Explain in detail the working principle of biosensors and chemical sensors. or
14. Describe the working principle of MEMS microaccelerometers.

MODULE III :
15. What are the two principal applications of electrohydrodynamics in microsystems. Explain or
16. Comment on “silicon as a substrate material” for MEMS devices.

MODULE IV :
17. Explain in detail photolithographic process for Microsystem Fabrication or
18. Describe physical vapor deposition with neat diagrams.

MODULE V :
19. How surface micromaching is implemented for fabrication of MEMS device. or
20. Comment extensively on different techniques associated with MEMS micromanufacturing.